IC socket with improved housing

ABSTRACT

An IC socket ( 1 ) includes an insulative housing ( 2 ) and large numbers of contacts ( 9 ) received therein. The housing defines arrayed contact receiving cavities ( 22 ) for accommodating the contacts. The cavities are arranged in array by first partition walls ( 24 ) and second partition walls ( 25 ), which are perpendicular to each other. The first partition wall is higher than the second partition wall. Each first partition wall is provided with protruding portions ( 240 ) and sunken portions ( 241 ), which are alternatively arranged.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention relates to an IC (integrated circuit) socket, on which anLGA (land grid array) package is mounted.

2. Description of the Related Arts

Modern computer systems increase in performance and complexity at a veryrapid pace, driven by intense competition and market demands. In orderto meet ever-increasing performance requirements, the area andvolumetric interconnect densities of electronic board assemblies mustincrease accordingly. In combination with other competitive forces, thisdemand has driven the need for improved high-density socket technologiesin computer applications, and the connector industry has responded witha variety of new alternatives to meet these needs. One of the mostattractive of the new connector types is the land grid array (LGA)socket connector, which permits direct electrical connection between anLGA integrated circuit and a printed circuit board. LGA socketconnectors are an evolving technology in which an interconnectionbetween mating surfaces of an IC or other area array device and aprinted circuit board is provided through a conductive terminal receivedin the socket connector. Connection is achieved by mechanicallycompressing the IC onto the socket connector.

A conventional IC socket for an LGA IC package with conductive padsgenerally comprises an insulative housing, and a plurality of contactsaccommodating in the housing. For contacting with pads of the LGA ICpackage, the contact is provided with a spring arm extending out of thehousing. However, the spring arm is easily to be damaged byinadvertently force, because there's no protective structure to protectthe spring arms. In order to solve this problem, an improved IC socketappears. The improved IC socket is provided with a plurality partitionwalls surrounding the spring arms for protect the arms, which can solvethe problem mentioned above. However, a new problem is produced. Asknown, the contact is inserted into the housing with carrier striplinking therewith. After the contact is positioned, the carrier stripmust be removed away. Due to the partition walls, the strip frequentlyinterferes with the partition wall, which seriously affect the operationefficiency.

In view of the above, what is needed is an IC socket which caneffectively protect the contacts received therein, and can improveoperation efficiency simultaneity.

SUMMARY OF THE INVENTION

According to the present invention, an improved IC socket is provided toresolve the disadvantages described above. The IC socket comprises ainsulative housing and a plurality of contact received therein. Thehousing defines a plurality of arrayed contact receiving cavities foraccommodating the contacts. The cavities are arranged in array by aplurality of first partition walls and a plurality of second partitionwalls, which are perpendicular to each other. The first partition wallis higher than the second partition wall. Each first partition wall isprovided with protruding portions and sunken portions, which arealternatively arranged.

Due to the partition walls, the contacts can be protected even ifinadvertently force is applied to the socket, and due to the sunkenportions, the strip can be removed away without interfere with thepartition walls.

Other advantages and novel features of the present invention will becomemore apparent from the following detailed description when taken inconjunction with the accompanying drawings, in which:

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an exploded isometric view of an IC socket in accordance witha preferred embodiment of the present invention;

FIG. 2 is an assembled view of FIG. 1;

FIG. 3 is an isometric view of an insulative housing of the IC socket;

FIG. 4 is an isometric view of an electrical contact of the IC socket;

FIG. 5 is an enlarged view of the circled part V in FIG. 3;

FIG. 6 is similar to FIG. 3, but illustrates the contacts received inthe housing;

FIG. 7 is an enlarged view of the circled part VII in FIG. 6; and

FIG. 8 is similar to FIG. 7, showing a virtual material strip linkingthe contacts.

DESCRIPTION OF PREFERRED EMBODIMENT

Hereinafter, a preferred embodiment of the invention will be describedin detail with reference to the attached drawings.

Referring first to FIGS. 1–2, the IC socket 1 comprises an insulativehousing 2, a metallic reinforcing plate 4 surrounding the housing 2, ametallic cover member 6 pivotally assembled to one end of thereinforcing plate 4, and a actuating lever 8 pivotally assembled to theother end of the reinforcing plate 4. The housing 2 is mountable on acircuit board (not shown).

An IC package receiving recess 20 is formed in the housing 2. Aplurality of contacts 9 are located in the IC package receiving recess20. An IC package (not shown) is secured in the housing 2 by firstpressing the cover member 6 downward so that the IC package is urgedagainst the contacts 9, then engaging the actuating lever 8 with anengaging piece 61 at the foot of the cover member 6. The reinforcingplate 4, the cover member 6, and the actuating lever 8 will collectivelybe referred to as a fixing mechanism.

Referring to FIG. 3 and FIGS. 5–6, the insulative housing 2 is generallyrectangular and is molded from an insulative material. The IC packagereceiving recess 20 is also rectangular as defined by outer peripheralwalls 21. Contact receiving cavities 22 are formed and arranged in amatrix. Each contact 9 is housed in a corresponding contact receivingcavity 22. A pair of opposed peripheral walls are formed with aplurality of channels 210. The contact receiving cavities 22 are definedin a matrix arrangement by first partition walls 24 and second partitionwalls 25, which are perpendicular to each other. Specially, the firstpartition wall 24 is higher than the second partition wall 25.

As illustrated in FIG. 5, the first partition wall 24 comprisesprotruding parts 240 and sunken parts 241, which are alternatelyarranged. Top surface of the protruding parts 240 forms a seating planefor carrying the IC package. It's noted that each of the channels 210 isaligned with not only a line of contact receiving cavities 22, but alsoa line of sunken portions 241.

Referring back to FIG. 4, which is a isometric view of one contact 9used in the IC socket 1. The contact 9 is formed from conductivematerial strip 95 (shown in FIG. 6) by stamping. Each contact 9comprises a base portion 90 secured in the contact receiving cavity 22,a soldering pad 91 perpendicularly extending from a lower end of thebase portion 90, a linking portion 92 connecting the strip 95, and aspring arm 93 extending from a lateral edge of the linking portion 92. Acontacting tip 94 is formed at a distal end of the spring arm 93. Thebase portion 90 is provided with a plurality of barbs 901 forinterferentially securing the contact 9 in the cavity 22.

When the IC package is mounted on the IC socket 1, the spring arms 93flex downward against lands (not shown) of the IC package. Thecontacting tips 94 flex below the protruding portion 240 of the firstpartition wall 24. Finally, the IC package is supported by the seatingplane formed by the protruding portions 240.

During mounting or dismounting of the IC package, a finger (not shown)may inadvertently touch or press the spring arms 93. However, downwardmovement of the finger is restricted by the first partition walls 24thus preventing excessive force on the spring arms 93. The spring arms93 remain within their ranges of elastic deformation as the fingercontacts the first partition walls 24. Therefore, plastic deformation ofthe spring arms 44 is prevented.

Referring to FIGS. 7–8, contacts 9 are inserted into the cavities 22with material strip 95 linking with the linking portions 92. After thecontacts 9 are positioned in the housing 2, the linking portions 92 arepositioned adjacent the sunken portions 241 of the first partition wall24, and the strip 95 must be removed form the linking portions 92.Accordingly, the strip 95 must be cut away form the top ends 920 of thelinking portions 92. And then, the strip 95 is removed along a directionAB shown in FIG. 8 via the sunken portions 241 and finally is removedfrom the housing 2 via the channels 210.

By virtue of the sunken portions 241 of the first partition wall 24, thestrip 95 does not interfere with the first partition wall 241, whichimprove operation efficiency.

Furthermore, although the present invention has been described withreference to particular embodiments, it is not to be construed as beinglimited thereto. Various alterations and modifications can be made tothe embodiments without in any way departing from the scope or spirit ofthe present invention as defined in the appended claims.

1. An Integrated Circuit (IC) socket to be mounted on a circuit board,comprising: an insulative housing, which has a plurality, of cavitiesarranged in a matrix at an IC package receiving recess surrounded byperipheral walls; a plurality of electrical contacts, which are providedin the plurality of cavities; and a fixing mechanism for fixing an ICpackage in the IC package receiving recess; wherein the insulativehousing comprises first partition walls, which are provided between rowsof cavities, and second partition walls, which are provided between rowsof cavities and are perpendicular to the first partition walls, thefirst partition walls having protruding portions and sunken portionsalternatively formed along a longitudinal direction thereof; wherein thefixing mechanism comprises a metallic reinforcing plate surrounding thehousing, a metallic cover member pivotally assembled to one end of thereinforcing plate, and an actuating lever pivotally assembled to theother end of the reinforcing plate.
 2. The IC socket as described inclaim 1, wherein the first partition walls have greater height than thatof the second partition walls.
 3. The IC socket as described in claim 1,wherein the peripheral walls of the housing definee a plurality ofchannels aligned with the sunken portions.
 4. An Integrated Circuit (IC)socket for carrying an IC package thereon, comprising: an insulativehousing, which has a plurality of cavities arranged in a matrix at an ICpackage receiving recess surrounded by peripheral walls; a plurality ofelectrical contacts secured in the plurality of cavities, the contactsbeing formed from a material strip and defines a spring arm extendingout of the housing; and a fixing mechanism for fixing an IC package inthe IC package receiving recess formed by peripheral walls; wherein theinsulative housing defines a plurality of partition walls partitioningthe cavities into a plurality of rows, and the partition walls areprovided with protruding portions and sunken portions, which arearranged alternatively, the protruding portions defines a seating planefor supporting the IC package; wherein two opposed peripheral walls ofthe housing define a plurality of channels corresponding to the sunkenportions.
 5. The IC socket as described in claim 4, wherein the fixingmechanism comprises a metallic reinforcing plate surrounding thehousing, a metallic cover member pivotally assembled to one end of thereinforcing plate, and an actuating lever pivotally assembled to theother end of the reinforcing plate.
 6. The IC socket as described inclaim 4, wherein each of the contact comprises a linking portionconnecting with the strip.
 7. The IC socket as described in claim 4,wherein the spring arm extends form the linking portion.
 8. The ICsocket as described in claim 4, wherein the linking portion of thecontact is located adjacent the sunken portion.
 9. An IC socket assemblycomprising: an insulative housing, which has a plurality of passagewaysarranged in matrix at an IC package receiving cavity surrounded byperipheral walls; a plurality of electrical contacts respectivelysecured in the plurality of passageways, the contacts being formed froma material strip and defines a spring arm upwardly extending into thereceiving cavity; and a moveable fixing mechanism for holding an ICpackage in the IC package receiving cavity; the insulative housingdefines a plurality of first partition walls partitioning thepassageways into a plurality of rows along a lengthwise direction of thehousing, and a plurality of second partition walls partitioning thepassageways into a plurality of columns along a transverse directionthat is perpendicular to said lengthwise direction; and an electronicpackage downwardly loaded to the receiving cavity to be seated to pressdownwardly the spring arms; wherein the second partition wall isrecessed below the first partition wall for allowing downward movementof the spring arm of the corresponding contact which extends across thesecond partitioning wall and is depressed downwardly by the electronicpackage.
 10. The IC socket assembly as claimed in claim 9, wherein saidfirst partition wall defines a sunken portion recessed from a topsurface thereof for facilitating detachment of the contact from thematerial strip during assembling.